SURFACE CHARACTERIZATION OF THE COPPER EPOXY ADHESION INTERFACE FROM PRODUCTION PRINTED-CIRCUIT BOARDS

被引：18

作者：

MILLER, CW ^{[1
]}

LABERGE, PC ^{[1
]}

机构：

[1] IBM CORP,DIV GEN TECHNOL,ESSEX JUNCTION,VT 05452

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1989年 / 7卷 / 03期

关键词：

D O I：

10.1116/1.576052

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1818 / 1822

页数：5

共 13 条

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[5] CHARACTERIZATION OF THE ADSORPTION OF POLY(ACRYLAMIDE), POLY(4-METHOXYSTYRENE), AND POLY(ACRYLIC ACID) ON ALUMINUM-OXIDE BY INELASTIC ELECTRON-TUNNELING SPECTROSCOPY [J].

COLLETTI, RF ;

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[6]

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[7]

Fowkes F.M., 1987, J ADHES SCI TECHNOL, V1, P7, DOI [10.1163/156856187x00049, 10.1163/156856187X00049, DOI 10.1163/156856187X00049]

[8]

GURIAN MI, 1985, PRINTED CIRC FABR, V8, P105

[9] AN INELASTIC ELECTRON TUNNELLING SPECTROSCOPY (IETS) STUDY OF POLY(VINYLACETATE) POLY(METHYL METHACRYLATE) AND POLY(VINYLALCOHOL) ADSORBED ON ALUMINUM-OXIDE [J].

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[10]

OSTRANDER CW, 1971, ELECTROPLATING ENG H, P437

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