We have fabricated high quality AlOx tunnel barriers on epitaxial niobium carbonitride (NbCN) base layers by the deposition of an Al layer followed by thermal oxidation. By careful control of its uniformity the thickness of the Al layer has been reduced to less than 3 nm which results in an average gap voltage, V-g(NbCN), of up to 2.65 mV. Using a self-aligned whole-wafer processing route we have made high quality NbCN/Al/AlOx/Al/Nb junctions as small as 0.6 mu m(2).