PROCESS TECHNOLOGY FOR PACKING APPLICATIONS

被引：4

作者：

BRESNOCK, FJ

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(88)90368-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：69 / 81

页数：13

共 9 条

[1] MICROELECTRONIC PACKAGING [J].

BLODGETT, AJ .

BLODGETT, AJ ;

BARBOUR, DR .

[3]

ETCHELLS RD, 1981, P SOC PHOTO-OPT INST, V282, P64, DOI 10.1117/12.931973

[4] COPPER POLYIMIDE MATERIALS SYSTEM FOR HIGH-PERFORMANCE PACKAGING [J].

JENSEN, RJ ;

CUMMINGS, JP ;

VORA, H .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1984, 7 (04) :384-393

[5] PIN VERSUS BLOCK RELATIONSHIP FOR PARTITIONS OF LOGIC GRAPHS [J].

LANDMAN, BS ;

RUSSO, RL .

[6]

LANE TA, 1987, 37TH ECC 1987 P, P614

NEUGEBAUER, CA ;

CARLSON, RO .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02) :184-189

[8]

SERAPHIM DP, 1978, IEEE T COMPON HYBR, V1, P305, DOI 10.1109/TCHMT.1978.1135287

[9]

SHIMADA Y, 1987, 37TH ECC 1987 P, P398