INTERGRANULAR ELECTROMIGRATION OF ANTIMONY IN SILVER

[1] ADDA Y, 1966, DIFFUSION SOLIDES, P742

[2] SUR LEELECTROLYSE DES ALLIAGES METALLIQUES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1962, 23 (JAN-F) : 123 - &

[3] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1972, 33 (04) : 845 - +

[4] ELECTROMIGRATION AND FAILURE IN ELECTRONICS - INTRODUCTION [J]. PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10): : 1409 - &

[5] FIKS VB, 1959, FIZ TVERD TELA, V1, P16

[6] CALCULATION OF DIFFUSION PENETRATION CURVES FOR SURFACE AND GRAIN BOUNDARY DIFFUSION [J]. JOURNAL OF APPLIED PHYSICS, 1951, 22 (01) : 74 - 77

[7] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) : 76 - 87

[8] KAIGORODOV VN, 1967, FIZ MET METALLOVED+, V24, P661

[9] KLOTSMAN SM, 1967, FIZ MET METALLOVED, V24, P278

[10] MARTIN G, 1972, R4363 CEA RAPP

[1] ADDA Y, 1966, DIFFUSION SOLIDES, P742

[2] SUR LEELECTROLYSE DES ALLIAGES METALLIQUES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1962, 23 (JAN-F) : 123 - &

[3] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1972, 33 (04) : 845 - +

[4] ELECTROMIGRATION AND FAILURE IN ELECTRONICS - INTRODUCTION [J]. PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10): : 1409 - &

[5] FIKS VB, 1959, FIZ TVERD TELA, V1, P16

[6] CALCULATION OF DIFFUSION PENETRATION CURVES FOR SURFACE AND GRAIN BOUNDARY DIFFUSION [J]. JOURNAL OF APPLIED PHYSICS, 1951, 22 (01) : 74 - 77

[7] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) : 76 - 87

[8] KAIGORODOV VN, 1967, FIZ MET METALLOVED+, V24, P661

[9] KLOTSMAN SM, 1967, FIZ MET METALLOVED, V24, P278

[10] MARTIN G, 1972, R4363 CEA RAPP