ELECTROMIGRATION AND FAILURE IN ELECTRONICS - INTRODUCTION

[1] Adda Y., 1966, DIFFUSION SOLIDS

[2] AGRAWALA BN, 1970, J APPL PHYS, V41, P3954

[3] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[4] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +

[5] ATTARDO MJ, 1968, 7 ANN REL PHYS S WAS, P7

[6] AUSTIN PM, TO BE PUBLISHED

[7] BARSON F, 1970, OCT EL SOC FALL M AT, P475

[8] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +

[9] STUDY OF FAILURE MECHANISMS IN AL-CU THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPY [J]. APPLIED PHYSICS LETTERS, 1971, 18 (07) : 284 - +

[10] BERENBAUM L, 1971, MAR REL PHYS S LAS V

[1] Adda Y., 1966, DIFFUSION SOLIDS

[2] AGRAWALA BN, 1970, J APPL PHYS, V41, P3954

[3] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[4] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +

[5] ATTARDO MJ, 1968, 7 ANN REL PHYS S WAS, P7

[6] AUSTIN PM, TO BE PUBLISHED

[7] BARSON F, 1970, OCT EL SOC FALL M AT, P475

[8] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +

[9] STUDY OF FAILURE MECHANISMS IN AL-CU THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPY [J]. APPLIED PHYSICS LETTERS, 1971, 18 (07) : 284 - +

[10] BERENBAUM L, 1971, MAR REL PHYS S LAS V