MEASUREMENT OF THE INTRINSIC STRESS IN THIN-FILMS OF SILVER BY A NEW CANTILEVERED PLATE TECHNIQUE

被引：9

作者：

LAUGIER, M

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(81)90398-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：213 / 219

页数：7

共 21 条

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[4] Chopra K.L, 1969, THIN FILM PHENOMENA
[5] ORIGINS OF STRESS IN THIN NICKEL FILMS
DOLJACK, FA
HOFFMAN, RW
[J]. THIN SOLID FILMS, 1972, 12 (01) : 71 - &
[6] SCANNING ELECTRON DIFFRACTION OF FILM GROWTH
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DOVE, DB
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1966, 3 (03): : 120 - &
[7] HERITAGE MB, 1968, THESIS CAMBRIDGE U G
[8] Hoffman R. W., 1966, PHYS THIN FILMS, VVol. 3, pp. 211
[9] STRESSES IN THIN-FILMS - RELEVANCE OF GRAIN-BOUNDARIES AND IMPURITIES
HOFFMAN, RW
[J]. THIN SOLID FILMS, 1976, 34 (02) : 185 - 190
[10] STRESS IN VERY THIN VACUUM-EVAPORATED FILMS OF SILVER
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[J]. JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1960, 15 (05) : 942 - 943