NEW ACCELERATION FACTORS FOR TEMPERATURE, HUMIDITY, BIAS TESTING

New temperature-humidity acceleration factors for surface conductance (G) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3–6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices. Copyright © 1979 by The Institute of Electrical and Electronics Engineers, Inc.