共 8 条
[4]
SnAgCuRE钎焊接头蠕变行为的研究[D]. 陈志刚.北京工业大学. 2003
[5]
钎焊手册[M]. - 机械工业出版社 , 张启运, 1999
[6]
Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints[J] . F. Guo,J. P. Lucas,K. N. Subramanian.Journal of Materials Science: Materials in Electronics . 2001 (1)