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Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solder[J] . M. S. Yeh.Journal of Electronic Materials . 2002 (9)
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Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders[J] . Chaosuan Kanchanomai,Yukio Miyashita,Yoshiharu Mutoh.Journal of Electronic Materials . 2002 (5)
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A viable tin-lead solder substitute: Sn-Ag-Cu[J] . Chad M. Miller,Iver E. Anderson,Jack F. Smith.Journal of Electronic Materials . 1994 (7)