The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

被引:153
作者
Wu, CML [1 ]
Yu, DQ
Law, CMT
Wang, L
机构
[1] City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Hong Kong, Peoples R China
[2] Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Peoples R China
关键词
Sn-9Zn lead-free solder; Ce and La rare earth elements; tensile strength; 0.2% proof stress; elongation; solderability; rosin-based active flux;
D O I
10.1007/s11664-002-0184-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The Sn-Zn alloys have been considered as lead-free solders. It is well known that their poor properties of wetting and oxidation resistance are the main problems to prevent them from becoming commercially viable solders. In this paper, trace rare earth (RE) elements of mainly Ce and La have been used as alloying elements into the Sn-9Zn alloy. The results indicated that with the RE addition the originally coarse beta-Sn grains in the microstructure of the alloy were refined. The tensile strength significantly increased with only a slight decrease in ductility. The surface tension was decreased, resulting in great improvement in wetting properties with rosin-based active flux.
引用
收藏
页码:921 / 927
页数:7
相关论文
共 12 条
[1]  
BAKER H, 1990, ASM HDB, V3, P372
[2]   MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF PB-FREE SOLDER ALLOYS FOR LOW-COST ELECTRONIC ASSEMBLY - A REVIEW [J].
GLAZER, J .
JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :693-700
[3]   Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying [J].
Huang, ML ;
Wu, CML ;
Lai, JKL ;
Wang, L ;
Wang, FG .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 11 (01) :57-65
[4]   Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate [J].
Lin, KL ;
Wang, YC .
JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (11) :1205-1210
[5]   The wetting of copper by Al Zn Sn solders [J].
Lin, KL ;
Wen, LH .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 1998, 9 (01) :5-8
[6]  
MA X, 2000, J CHINESE RARE EARTH, V18, P135
[7]   NEW LEAD-FREE, SN-ZN-IN SOLDER ALLOYS [J].
MCCORMACK, M ;
JIN, S ;
CHEN, HS ;
MACHUSAK, DA .
JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :687-690
[8]   NEW, LEAD-FREE SOLDERS [J].
MCCORMACK, M ;
JIN, S .
JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :635-640
[9]   Wetting and interface microstructure between Sn-Zn binary alloys and Cu [J].
Suganuma, K ;
Niihara, K ;
Shoutoku, T ;
Nakamura, Y .
JOURNAL OF MATERIALS RESEARCH, 1998, 13 (10) :2859-2865
[10]   Heat resistance of Sn-9Zn solder/Cu interface with or without coating [J].
Suganuma, K ;
Murata, T ;
Noguchi, H ;
Toyoda, Y .
JOURNAL OF MATERIALS RESEARCH, 2000, 15 (04) :884-891