An ion-assisted Mo-Si deposition process for planarizing reticle substrates for extreme ultraviolet lithography

被引:26
作者
Mirkarimi, PB [1 ]
Spiller, EA
Stearns, DG
Sperry, V
Baker, SL
机构
[1] Lawrence Livermore Natl Lab, Livermore, CA 94550 USA
[2] Spiller Xray Opt, Mt Kisco, NY 10549 USA
[3] OS Associates, Mt View, CA 94040 USA
关键词
ion beam applications; integrated circuit fabrication; masks; photolithography; thin films;
D O I
10.1109/3.970896
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Substrate particles are a serious concern in the fabrication of reticles for extreme ultraviolet lithography (EUVL) because they nucleate defects in the reflective multilayer films that can print in the lithographic image. We have developed a strategy for planarizing reticle substrates with smoothing-layers and, in this letter, we investigate the smoothing properties of an ion-assisted Mo-Si deposition process. We have observed that ion-assistance can significantly improve the particle-smoothing properties of Mo-Si multilayer films and can do so without a significant increase in the high-spatial frequency roughness of the multilayer film. An ion-assisted Mo-Si smoothing-layer approach to reticle substrate planarization, therefore, shows significant promise for defect mitigation in EUVL reticles.
引用
收藏
页码:1514 / 1516
页数:3
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