Micromachining of (hhl) silicon structures: experiments and 3D simulation of etched shapes

被引:27
作者
Tellier, CR
Durand, S
机构
[1] Laboratoire de Chronométrie, Electron. et Piezoelectricite, F-25030 Besançon Cedex
[2] University du Maine, Le Mans
[3] Faculty of Sciences, University of Franche-Comté, Besançon
关键词
etching; micromachining; simulations; silicon plates;
D O I
10.1016/S0924-4247(96)01418-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The micromachining of various (hhl) silicon plates in a 35% KOH-water etchant is studied. Experimental shapes for membranes and mesa etched with initially circular masks are discussed. Theoretical 3D etched shapes for such microstructures are derived from a numerical simulation based on the tensorial model for the anisotropic wet etching. Experimental and theoretical shapes show a fair agreement, indicating a satisfactory adjustment of the dissolution slowness surface related to the etching of silicon in KOH etchant. The interest of the 3D simulation for designing mask patterns is outlined.
引用
收藏
页码:168 / 175
页数:8
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