共 22 条
[2]
ARNOLD AF, 1974, Patent No. 3857733
[3]
CHRISTOPH J, 1977, ELECTROPLATING PLAST, P1
[4]
CONTOLINI RJ, 1995, 12 INT VLSI MULT INT, P322
[6]
Ebneth H., 1967, GALVANOTECHNIK, V58, P308
[7]
LOW-TEMPERATURE OXIDATION BEHAVIOR OF REACTIVELY SPUTTERED TIN BY X-RAY PHOTOELECTRON-SPECTROSCOPY AND CONTACT RESISTANCE MEASUREMENTS
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1986, 4 (06)
:2784-2788
[8]
Evans U.R., 1963, An Introduction to Metallic Corrosion
[9]
Feldman L. C., 1986, Fundamentals of Surface and Thin Film Analysis
[10]
Copper electroplating for future ultralarge scale integration interconnection
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
2000, 18 (02)
:656-660