High-performance fully depleted silicon-nanowire (diameter ≤ 5 nm) gate-all-around CMOS devices

被引:540
作者
Singh, N. [1 ]
Agarwal, A. [1 ]
Bera, L. K. [1 ]
Liow, T. Y. [1 ]
Yang, R. [1 ]
Rustagi, S. C. [1 ]
Tung, C. H. [1 ]
Kumar, R. [1 ]
Lo, G. Q. [1 ]
Balasubramanian, N. [1 ]
Kwong, D. -L. [1 ]
机构
[1] Inst Microelect, Singapore 117685, Singapore
关键词
CMOS-compatible process; gate-all-around (GAA); silicon nanowire transistor; surround gate; wrap-around-gate;
D O I
10.1109/LED.2006.873381
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with <= 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g-, near ideal subthreshold slope (similar to 63 mWdec), low drain-induced barrier lowering (similar to 10 V/V), and with I-ON/I-OFF ratio of similar to 10(6). High drive currents of similar to 1.5 and similar to 1.0 mA/mu m were achieved for 180-nm-long n- and p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.
引用
收藏
页码:383 / 386
页数:4
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