Nanomaterial transfer using hot embossing for flexible electronic devices

被引：20

作者：

Allen, AC ^{[1
]}

Sunden, E ^{[1
]}

Cannon, A ^{[1
]}

Graham, S ^{[1
]}

King, W ^{[1
]}

机构：

[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA

来源：

APPLIED PHYSICS LETTERS | 2006年 / 88卷 / 08期

关键词：

D O I：

10.1063/1.2178414

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We demonstrate hot embossing to pattern carbon nanotubes (CNTs) on flexible substrates. Patterns of CNTs grown on both microtextured and flat silicon templates were transferred into polymer substrates, with good replication of both the CNT patterns and surface relief features. The transferred CNTs formed a highly entangled network with electrical resistance of 1 k Omega-9 M Omega, depending on growth and embossing conditions. The electrical properties showed a strong sensitivity to both light and temperature. This dry transfer process shows promise for high throughput manufacturing of nanomaterial-based flexible electronic devices. (c) 2006 American Institute of Physics.

引用

页数：3

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