Flexible dome and bump shape piezoelectric tactile sensors using PVDF-TrFE copolymer

被引:189
作者
Li, Chunyan [1 ]
Wu, Pei-Ming [1 ]
Lee, Soohyun [1 ]
Gorton, Andrew [2 ]
Schulz, Mark J. [2 ]
Ahn, Chong H. [1 ]
机构
[1] Univ Cincinnati, Microsyst & BioMEMS Lab, Dept Elect & Comp Engn, Cincinnati, OH 45221 USA
[2] Univ Cincinnati, Smart Struct Bionanotechnol Lab, Dept Mech Engn, Cincinnati, OH 45221 USA
关键词
bump shape; dome shape; flexible tactile sensor; mold-transfer method; piezoelectric devices; polyvinylidene-fluoride-trifluoroethylene (PVDF-TrFE) piezoelectric copolymer;
D O I
10.1109/JMEMS.2007.911375
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a new mold-transfer method to pattern piezoelectric polymer has been developed and applied to fabricate innovative dome and bump shape polyvinylidene-fluoride-trifluoroethylene (PVDF-TrFE) films. The dome and bump shape PVDF-TrFE films have been successfully fabricated and characterized as a sensing component for flexible tactile sensors. The tactile sensors developed using these polymer microstructures show a high sensitivity which can measure as small as 40 mN force for bump shape sensors and 25 mN for dome shape sensors. The newly developed fabrication method provides a flexible way to pattern the piezoelectric polymer with different shapes and dimensions, including bump and dome shape piezoelectric polymer microstructures. In addition, a selective dc poling method for the PVDF-TrFE film has been developed for fabricating precisely located piezoelectric sensors with minimum crosstalk. The bump and dome shape PVDF-TrFE films developed in this paper can have numerous applications for microcatheters or other minimally invasive biomedical devices.
引用
收藏
页码:334 / 341
页数:8
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