Lifetime extrapolation for IGBT modules under realistic operation conditions

被引：15

作者：

Ciappa, M ^{[1
]}

Malberti, P

Fichtner, W

Cova, P

Cattani, L

Fantini, F

机构：

[1] Swiss Fed Inst Technol, Integrated Syst Lab, CH-8092 Zurich, Switzerland

[2] Univ Parma, Dept Informat Engn, I-43100 Parma, Italy

来源：

MICROELECTRONICS RELIABILITY | 1999年 / 39卷 / 6-7期

关键词：

D O I：

10.1016/S0026-2714(99)00160-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper a systematic approach is presented for extrapolating the lifetime due to bond wire lift-off in IGBT modules submitted to cyclic loading, Application profiles of the device are considered, as they are usually encountered in real current converters for railway traction systems. The proposed lifetime prediction scheme is based on the principle of the linear accumulation of the fatigue damage and takes into account the redundancy of the bond wires. (C) 1999 Elsevier Science Ltd. All rights reserved.

引用

页码：1131 / 1136

页数：6

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