Performance improvement of SONOS memory by bandgap engineering of charge-trapping layer

被引:78
作者
Chen, TS [1 ]
Wu, KH
Chung, H
Kao, CH
机构
[1] Natl Def Univ, Dept Elect Engn, Chung Cheng Inst Technol, Taoyuan 33501, Taiwan
[2] Natl Def Univ, Chung Cheng Inst Technol, Sch Def Sci, Taoyuan 33501, Taiwan
[3] Natl Def Univ, Chung Cheng Inst Technol, Dept Appl Phys, Taoyuan 33501, Taiwan
关键词
endurance; reliability; retention; silicon-oxide-nitride-oxide-silicon (SONOS);
D O I
10.1109/LED.2004.825163
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A significant improvement in device performance and reliability characteristics of silicon-oxide-nitride-oxide-silicon (SONOS) Flash memory has been achieved. Superior endurance characteristic shows no sign of degradation even after 10(6), program/erase cycles and an extrapolated ten-year detection window of 1.4 V has been attained from retention measurement. The dramatic improvement results from a bandgap engineering of the SiN charge-trapping layer. With a gradual variation of the SiN ratio from bottom to top of nitride film rather than uniform standard composition, a large number of highly accessible trapping levels are created in addition to the deepened barrier height between nitride and tunnel oxide that reduces back-tunneling probability. The proposed technique shall be valuable in pushing Flash memory technology into the next generation.
引用
收藏
页码:205 / 207
页数:3
相关论文
共 8 条
[1]   Effects of two-step high temperature deuterium anneals on SONOS nonvolatile memory devices [J].
Bu, JK ;
White, MH .
IEEE ELECTRON DEVICE LETTERS, 2001, 22 (01) :17-19
[2]   NROM: A novel localized trapping, 2-bit nonvolatile memory cell [J].
Eitan, B ;
Pavan, P ;
Bloom, I ;
Aloni, E ;
Frommer, A ;
Finzi, D .
IEEE ELECTRON DEVICE LETTERS, 2000, 21 (11) :543-545
[3]   DESIGN AND SCALING OF A SONOS MULTIDIELECTRIC DEVICE FOR NONVOLATILE MEMORY APPLICATIONS [J].
FRENCH, ML ;
CHEN, CY ;
SATHIANATHAN, H ;
WHITE, MH .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (03) :390-397
[4]   Flash memory cells - An overview [J].
Pavan, P ;
Bez, R ;
Olivo, P ;
Zanoni, E .
PROCEEDINGS OF THE IEEE, 1997, 85 (08) :1248-1271
[5]   Silicon-nitride as a tunnel dielectric for improved SONOS-type flash memory [J].
She, M ;
Takeuchi, H ;
King, TJ .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (05) :309-311
[6]   CHEMICALLY BOUND HYDROGEN IN CVD SI3N4 - DEPENDENCE ON NH3/SIH4 RATIO AND ON ANNEALING [J].
STEIN, HJ ;
WEGENER, HAR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (06) :908-912
[7]   Cause of data retention loss in a nitride-based localized trapping storage flash memory cell [J].
Tsai, WJ ;
Gu, SH ;
Zous, NK ;
Yeh, CC ;
Liu, CC ;
Chen, CH ;
Wang, TH ;
Pan, S ;
Lu, CY .
40TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2002, :34-38
[8]  
WILLIAMS D, 1994, PROC NAECON IEEE NAT, P761, DOI 10.1109/NAECON.1994.332963