Mechanism of flatband voltage roll-off studied with Al2O3 film deposited on terraced oxide

被引:34
作者
Choi, Kisik [1 ]
Wen, Huang-Chun [1 ]
Bersuker, Gennadi [1 ]
Harris, Rusty [1 ]
Lee, Byoung Hun [1 ]
机构
[1] SEMATECH, Austin, TX 78741 USA
关键词
D O I
10.1063/1.2993335
中图分类号
O59 [应用物理学];
学科分类号
摘要
The mechanism of flatband voltage roll-off (FVRO) has been investigated with capacitors fabricated on terraced oxide with various thicknesses of Al(2)O(3) film deposited by atomic layer deposition. It is found that the FVRO is mainly controlled by the thickness of the bottom interfacial layer and is independent of Al(2)O(3) thickness. This indicates that the dipole at the SiO(2)/Al(2)O(3) interface is mainly responsible for the FVRO phenomenon rather than the charges. Electrostatic analysis suggests that the disruption of the interface dipole by oxygen vacancy generated in thinner bottom interfacial layer is a potential cause of the FVRO. (C) 2008 American Institute of Physics.
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页数:3
相关论文
共 15 条
[1]  
ALSHAREEF HN, 2006, VLSI S, P7
[2]  
[Anonymous], VLSI S
[3]  
BERSUKER G, 2008, P ESSDERC UNPUB, P71113
[4]  
BROWN G, 2004, P IEEE SISC C UNPUB, P71113
[5]  
Hauser JR, 1998, AIP CONF PROC, V449, P235
[6]   Evaluation of fermi level pinning in low, midgap and high workfunction metal gate electrodes on ALD and MOCVD HfO2 under high temperature exposure [J].
Jha, R ;
Lee, JH ;
Chen, B ;
Lazar, H ;
Gurganus, J ;
Biswas, N ;
Majhi, P ;
Brown, G ;
Misra, V .
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, :295-298
[7]  
KADOSHIMA M, 2007, VLSI S, P66
[8]   Gate stack technology for nanoscale devices [J].
Lee, Byoung Hun ;
Oh, Jungwoo ;
Tseng, Hsing Huang ;
Jammy, Rajarao ;
Huff, Howard .
MATERIALS TODAY, 2006, 9 (06) :32-40
[9]  
LINDER BP, 2007, P INT C SOL STAT DEV, P16
[10]   A 45nm logic technology with high-k plus metal gate transistors, strained silicon, 9 Cu interconnect layers, 193nm dry patterning, and 100% Pb-free packaging [J].
Mistry, K. ;
Allen, C. ;
Auth, C. ;
Beattie, B. ;
Bergstrom, D. ;
Bost, M. ;
Brazier, M. ;
Buehler, M. ;
Cappellani, A. ;
Chau, R. ;
Choi, C. -H. ;
Ding, G. ;
Fischer, K. ;
Ghani, T. ;
Grover, R. ;
Han, W. ;
Hanken, D. ;
Hatttendorf, M. ;
He, J. ;
Hicks, J. ;
Huessner, R. ;
Ingerly, D. ;
Jain, P. ;
James, R. ;
Jong, L. ;
Joshi, S. ;
Kenyon, C. ;
Kuhn, K. ;
Lee, K. ;
Liu, H. ;
Maiz, J. ;
McIntyre, B. ;
Moon, P. ;
Neirynck, J. ;
Pei, S. ;
Parker, C. ;
Parsons, D. ;
Prasad, C. ;
Pipes, L. ;
Prince, M. ;
Ranade, P. ;
Reynolds, T. ;
Sandford, J. ;
Schifren, L. ;
Sebastian, J. ;
Seiple, J. ;
Simon, D. ;
Sivakumar, S. ;
Smith, P. ;
Thomas, C. .
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, :247-+