Epitaxial nanotwinned Cu films with high strength and high conductivity

被引:212
作者
Anderoglu, O. [1 ]
Misra, A. [2 ]
Wang, H. [3 ]
Ronning, F. [2 ]
Hundley, M. F. [2 ]
Zhang, X. [1 ]
机构
[1] Texas A&M Univ, Dept Mech Engn, College Stn, TX 77843 USA
[2] Los Alamos Natl Lab, Mat Phys & Applicat Div, Los Alamos, NM 87545 USA
[3] Texas A&M Univ, Dept Elect Engn, College Stn, TX 77843 USA
关键词
D O I
10.1063/1.2969409
中图分类号
O59 [应用物理学];
学科分类号
摘要
We report on the synthesis of epitaxial (single-crystal-like), nanotwinned Cu films via magnetron sputtering. Increasing the deposition rate from 1 to 4 nm/s decreased the average twin lamellae spacing from 16 to 7 nm. These epitaxial nanotwinned Cu films exhibit significantly higher ratio of hardness to room temperature electrical resistivity than columnar grain (nanocrystalline), textured, nanotwinned Cu films. (C) 2008 American Institute of Physics.
引用
收藏
页数:3
相关论文
共 32 条
[1]   Strengthening in gold nanopillars with nanoscale twins [J].
Afanasyev, Konstantin A. ;
Sansoz, Frederic .
NANO LETTERS, 2007, 7 (07) :2056-2062
[2]   Thermal stability of sputtered Cu films with nanoscale growth twins [J].
Anderoglu, O. ;
Misra, A. ;
Wang, H. ;
Zhang, X. .
JOURNAL OF APPLIED PHYSICS, 2008, 103 (09)
[3]  
ANDEROGLU O, UNPUB
[4]   MICROSTRUCTURE OF THIN SINGLE CRYSTALS OF COPPER [J].
BROCKWAY, LO ;
MARCUS, RB .
JOURNAL OF APPLIED PHYSICS, 1963, 34 (04) :921-&
[5]   Repulsive force between screw dislocation and coherent twin boundary in aluminum and copper [J].
Chen, Zhiming ;
Jin, Zhaohui ;
Gao, Huajian .
PHYSICAL REVIEW B, 2007, 75 (21)
[6]   Tensile properties of in situ consolidated nanocrystalline Cu [J].
Cheng, S ;
Ma, E ;
Wang, YM ;
Kecskes, LJ ;
Youssef, KM ;
Koch, CC ;
Trociewitz, UP ;
Han, K .
ACTA MATERIALIA, 2005, 53 (05) :1521-1533
[7]   Highly textured and twinned Cu films fabricated by pulsed electrodeposition [J].
Cui, B. Z. ;
Han, K. ;
Xin, Y. ;
Waryoba, D. R. ;
Mbaruku, A. L. .
ACTA MATERIALIA, 2007, 55 (13) :4429-4438
[8]   Strength, strain-rate sensitivity and ductility of copper with nanoscale twins [J].
Dao, M. ;
Lu, L. ;
Shen, Y. F. ;
Suresh, S. .
ACTA MATERIALIA, 2006, 54 (20) :5421-5432
[9]  
FEDER J, 1975, THIN SOLID FILMS, V31, P183
[10]   THE STRAIN AND GRAIN-SIZE DEPENDENCE OF THE FLOW-STRESS OF COPPER [J].
HANSEN, N ;
RALPH, B .
ACTA METALLURGICA, 1982, 30 (02) :411-417