High current density 800-V 4H-SiC gate turn-off thyristors

被引:22
作者
Li, B [1 ]
Cao, L
Zhao, JH
机构
[1] Rutgers State Univ, SiCLAB, Piscataway, NJ 08855 USA
[2] Rutgers State Univ, Dept Elect & Comp Engn, Piscataway, NJ 08855 USA
基金
美国国家科学基金会;
关键词
ICP; SiC; switching; thyristor;
D O I
10.1109/55.761020
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
4H-SiC gate turn-off thyristors (GTO's) were fabricated using the recently developed inductively coupled plasma (ICP) dry etching technique, DC and ac characterization have been done to evaluate forward blocking voltage, leakage current, on-state voltage drop and switching performance. GTO's over 800 V de blocking capability has been demonstrated with a blocking layer thickness of 7 mu m The de on-state voltage drops of a typical device at 25 and 300 degrees C were 4.5 and 3.6 V, respectively, for a current density of 1000 A/cm(2). The devices can be reliably turned on and turned off under an anode current density of 5000 A/cm(2) without observable degradation.
引用
收藏
页码:219 / 222
页数:4
相关论文
共 10 条
[1]   700-V asymmetrical 4H-SiC gate turn-off thyristors (GTO's) [J].
Agarwal, AK ;
Casady, JB ;
Rowland, LB ;
Seshadri, S ;
Siergiej, RR ;
Valek, WF ;
Brandt, CD .
IEEE ELECTRON DEVICE LETTERS, 1997, 18 (11) :518-520
[2]  
[Anonymous], P MAT RES SOC S
[3]  
BALIGA BJ, 1987, MODERN POWER DEVICES
[4]  
CAO L, UNPUB J ELECTROCHEM
[5]   Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review [J].
Casady, JB ;
Johnson, RW .
SOLID-STATE ELECTRONICS, 1996, 39 (10) :1409-1422
[6]   4H-SiC gate turn-off (GTO) thyristor development [J].
Casady, JB ;
Agarwal, AK ;
Rowland, LB ;
Siergiej, RR ;
Seshadri, S ;
Mani, S ;
Barrows, J ;
Piccone, D ;
Sanger, PA ;
Brandt, CD .
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 :1069-1072
[7]  
LI BA, UNPUB PHYS LETT
[8]  
PALMOUR JW, 1994, P MAT RES S, V339, P133
[9]  
PALMOUR JW, 1996, T 3 INT C HIGH TEMP, V2
[10]  
XIE K, 1994, INTERNATIONAL ELECTRON DEVICES MEETING 1994 - IEDM TECHNICAL DIGEST, P415, DOI 10.1109/IEDM.1994.383379