High rate sputter deposition of TiO2 from TiO2-x target

被引：34

作者：

Ohsaki, H ^{[1
]}

Tachibana, Y ^{[1
]}

Hayashi, A ^{[1
]}

Mitsui, A ^{[1
]}

Hayashi, Y ^{[1
]}

机构：

[1] Asahi Glass Co Ltd, Res Ctr, Kanagawa Ku, Yokohama, Kanagawa 2218755, Japan

来源：

THIN SOLID FILMS | 1999年 / 351卷 / 1-2期

关键词：

sputtering; titanium oxide;

D O I：

10.1016/S0040-6090(99)00207-2

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

A new sputter technique for high rate deposition of TiO2 was developed for applying to common planar magnetron sputter system. With this technique, using plasma sprayed TiO2-x targets and a sputter gas of a few percent of O-2 diluted with Ar, TiO2 films are deposited with a high deposition rate efficiency (deposition rate per applied power density) being almost eight times larger than that of the conventional sputter method using Ti target and O-2 sputter gas. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：57 / 60

页数：4

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