Thermal monitoring and testing of electronic systems

被引：8

作者：

Székely, V ^{[1
]}

Rencz, M

Páhi, A

Courtois, B

机构：

[1] Tech Univ Budapest, Dept Electron Devices, H-1521 Budapest, Hungary

[2] MicReD Microelect Res & Dev Ltd, Budapest 27, Hungary

[3] TIMA Lab, F-38031 Grenoble, France

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1999年 / 22卷 / 02期

关键词：

CMOS temperature sensors; overheating protection; thermal monitoring; thermal testing via BS;

D O I：

10.1109/6144.774737

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The paper presents a method for online overheating protection of electronic systems. The keg elements of the implementation, the thermal sensor and a chip dedicated to thermal monitoring of the various components are presented in details. Beyond on line thermal monitoring, offline static and transient thermal testing are also enabled by the suggested method, using the standard test circuitry, the boundary scan.

引用

页码：231 / 237

页数：7

共 10 条

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