Boride-enhanced diffusion in silicon: Bulk and surface layers

被引:35
作者
Cowern, NEB [1 ]
Theunissen, MJJ [1 ]
Roozeboom, F [1 ]
van Berkum, JGM [1 ]
机构
[1] Philips Res Labs, NL-5656 AA Eindhoven, Netherlands
关键词
D O I
10.1063/1.124312
中图分类号
O59 [应用物理学];
学科分类号
摘要
Epitaxial silicon boride layers, located at the surface or within the bulk of single-crystal silicon, give rise to enhanced diffusion of B during annealing. A submonolayer buried boride layer releases approximate to 0.4 interstitials per B atom in the layer, generating a transient diffusion enhancement in the range of 10-100 for several minutes at 900 degrees C. The resulting profile broadening is comparable to that caused by ion implantation damage. At the same temperature, surface boride layers generate a diffusion enhancement of similar to 6, part of which arises from the B diffusion flux and part from the chemical influence of the boride layer. (C) 1999 American Institute of Physics. [S0003-6951(99)00428-3].
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页码:181 / 183
页数:3
相关论文
共 17 条
[1]  
AGARWAL A, 1997, P 4 INT WORKSH MEAS
[2]  
AGARWAL A, 1998, MAT SCI SEMICOND PRO, V3, P237
[3]  
Agarwal A., 1998, MAT SCI SEMICON PROC, V1, P17
[4]  
ARIENZO WAO, 1988, J APPL PHYS, V63, P116, DOI 10.1063/1.340500
[5]   Properties of intrinsic point defects in silicon determined by zinc diffusion experiments under nonequilibrium conditions [J].
Bracht, H ;
Stolwijk, NA ;
Mehrer, H .
PHYSICAL REVIEW B, 1995, 52 (23) :16542-16560
[6]   The fraction of substitutional boron in silicon during ion implantation and thermal annealing [J].
Caturla, MJ ;
Johnson, MD ;
de la Rubia, TD .
APPLIED PHYSICS LETTERS, 1998, 72 (21) :2736-2738
[7]   Role of C and B clusters in transient diffusion of B in silicon [J].
Cowern, NEB ;
Cacciato, A ;
Custer, JS ;
Saris, FW ;
Vandervorst, W .
APPLIED PHYSICS LETTERS, 1996, 68 (08) :1150-1152
[8]  
DUNHAM ST, 1998, P INT EL DEV M 6 9 D
[9]  
FAIR RB, 1991, IMPURITY DOPING PROC, P315
[10]  
Hu S. M., 1981, Defects in Semiconductors. Proceedings of the Materials Research Society Annual Meeting, P333