Thermophoretic deposition of palladium aerosol nanoparticles for electroless micropatterning of copper

被引:17
作者
Byeon, Jeong Hoon [2 ]
Yoon, Ki Young [1 ]
Jung, Yee Kyeong [1 ]
Hwang, Jungho [1 ,3 ]
机构
[1] Yonsei Univ, Sch Mech Engn, Seoul 120749, South Korea
[2] Samsung Elect Co Ltd, Digital Printing Div, Suwon 443742, South Korea
[3] Yonsei Univ, Yonsei Ctr Clean Technol, Seoul 120749, South Korea
关键词
site-selective catalytic activation; palladium aerosol nanoparticles; electroless copper deposition; micropatterning;
D O I
10.1016/j.elecom.2008.06.025
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A method for catalytic activation was introduced by producing palladium aerosol nanoparticles via spark generation and then thermophoretically depositing the particles onto a flexible polyimide substrate through a hole in pattern mask, resulting in a line (24 mu m in width) and a square (136 mu m x 136 mu m) patterns. After annealing, the catalytically activated substrate was placed into a solution for electroless copper deposition. Finally, copper micropatterns of a line (35 mu m in width) and a square (165 mu m x 165 mu m) were formed only on the activated regions of the substrate. Both patterns had the height of 1.6 mu m. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:1272 / 1275
页数:4
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