Selective electroless metal deposition using microcontact printing of phosphine-phosphonic acid inks

We report a low-cost approach to selectively deposit films of nickel and copper on glass substrates. Our approach uses microcontact printing of organic inks containing phosphonic acid groups to bind the ink to a glass substrate and phosphine groups to bind a colloidal catalyst that initiates electroless metallization. We demonstrate this procedure by fabricating patterned nickel and copper films with areas as large as 15 cm(2) and minimum feature sizes of similar to2 mum. We present studies on the use of two ink types, an oligomer and a bifunctional molecule, and demonstrate that pattern quality and adhesion of the metallized films depends on the molecular weight of the ink and the ratio of phosphine and phosphonic acid groups.