Step and flash imprint lithography: Defect analysis

被引:45
作者
Bailey, T [1 ]
Smith, B [1 ]
Choi, BJ [1 ]
Colburn, M [1 ]
Meissl, M [1 ]
Sreenivasan, SV [1 ]
Ekerdt, JG [1 ]
Willson, CG [1 ]
机构
[1] Univ Texas, Texas Mat Inst, Austin, TX 78712 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 06期
关键词
D O I
10.1116/1.1420203
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Step and flash imprint lithography (SFIL) is a promising, low cost alternative to projection printing. This technique has demonstrated very high resolution and overlay alignment capabilities, but it is a contact printing technique so there is concern about defect generation and propagation. A series of experiments has been carried out with the goal of quantifying the effect of defect propagation. To that end, each unit process in SFIL was studied independently. The number of particles added during handling and transportation and due to SFIL machinery was deemed acceptable, and the added particles should not complicate the inspection of process defects. The concept of a "self-cleaning" process in which the imprint template becomes cleaner by imprinting was revisited. Inspection of an imprint template before and after imprinting revealed that the template actually becomes cleaner with imprinting. Visual inspection of multiple imprints did not reveal any systematic generation or propagation of defects. The inspection area used in this study was limited, however, since the inspection was both manual and visual. Imprinting for this defect study was performed at the University of Texas in a Class 10 cleanroom, and inspection was performed at International SEMATECH. (C) 2001 American Vacuum Society.
引用
收藏
页码:2806 / 2810
页数:5
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