Periphery protection for silicon carbide devices: State of the art and simulation

被引:20
作者
Planson, D [1 ]
Locatelli, ML [1 ]
Ortolland, S [1 ]
Chante, JP [1 ]
Mitlehner, H [1 ]
Stephani, D [1 ]
机构
[1] SIEMENS AG,CORP RES & DEV,D-91052 ERLANGEN,GERMANY
来源
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 1997年 / 46卷 / 1-3期
关键词
high voltage capability; semi-insulating surface; silicon carbide;
D O I
10.1016/S0921-5107(96)01983-6
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Silicon carbide (SiC) is well known for its large potentiality for power device applications. SiC presents a high critical electric field, allowing small dimensions and relatively high doping levels, favorable for reduced power losses in the on-state together with high blocking voltage capability. SIC has a wide band-gap, inducing very low intrinsic carrier concentrations even at high temperature. and consequently allows very low leakage currents and off-state pou sr losses. The present paper focuses on problems related to the high voltage capability of SiC components. After dealing with the bulk breakdown voltage of a SiC semi-infinite parallel-plane abrupt junction, a short review of the methods allowing the potential distribution spreading near the periphery of the real junction is given. Some methods have been implemented and the edge-termination protection has been optimized by the way of numerical simulation. This includes equipotential rings, junction termination extension as planar protections, and MESA as an etched-contour periphery. Examples of realizations are given, and electrical characteristics are presented. They show a better capability of the junction termination extension periphery over the MESA technique to reach a 1500 V-blocking voltage objective. (C) 1997 Elsevier Science S.A.
引用
收藏
页码:210 / 217
页数:8
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