Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging

被引：29

作者：

Kim, J ^{[1
]}

Chiao, M ^{[1
]}

Lin, LW ^{[1
]}

机构：

[1] Univ Calif Berkeley, Dept Mech Engn, Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA

来源：

FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年

关键词：

D O I：

10.1109/MEMSYS.2002.984291

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper the feasibility of ultrasonic bonding for hermetic MEMS packaging has been demonstrated for the first time adopting two different sets of materials; indium-to-gold and aluminum-to-aluminum. The process utilizes purely mechanical vibration energy and enables low temperature bonding between similar or dissimilar materials without precleaning of the bonding surfaces. As such, ultrasonic bonding can be broadly applied not only for electrical interconnection. but also for hermetic MEMS sealing and packaging especially where temperature limitation is a critical issue. This paper describes the ultrasonic bonding and hermetic sealing processes as well as the bonding tool characterization and equipment setups.

引用

页码：415 / 418

页数：4

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