Infrared diode laser absorption spectroscopy measurements of CFX (X=1-3) radical densities in electron cyclotron employing C4F8, C2F6, CF4, and CHF3 gases

被引:86
作者
Miyata, K
Hori, M
Goto, T
机构
[1] Department of Quantum Engineering, Nagoya University, Chikusa-ku, Nagoya 464-01, Furo-cho
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1996年 / 14卷 / 04期
关键词
D O I
10.1116/1.580020
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Infrared diode laser absorption spectroscopy was used for measuring CFX (X=1-3) radical densities in electron cyclotron resonance plasmas employing C4F8, C2F6, CF4, and CHF3 gases commonly used for the plasma etching of silicon dioxide. CFX (X=1-3) radical densities in these plasmas were measured systematically together with CHF3 and CF4 molecular densities as a function of microwave power and as a function of H-2 dilution. Furthermore, variations of F atom densities in these plasmas were also investigated by the actinometry technique. The differences in the radical and atomic densities according to fluorocarbon feed gases are discussed based on their molecular structures and atomic component ratios (carbon/fluorine and hydrogen/fluorine). (C) 1996 American Vacuum Society.
引用
收藏
页码:2343 / 2350
页数:8
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共 30 条
[1]   DEPOSITION IN DRY-ETCHING GAS PLASMAS [J].
ARAI, S ;
TSUJIMOTO, K ;
TACHI, S .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (6B) :2011-2019
[2]   OPTICAL-EMISSION SPECTROSCOPY OF REACTIVE PLASMAS - A METHOD FOR CORRELATING EMISSION INTENSITIES TO REACTIVE PARTICLE DENSITY [J].
COBURN, JW ;
CHEN, M .
JOURNAL OF APPLIED PHYSICS, 1980, 51 (06) :3134-3136
[3]   MECHANISM OF ETCHING, POLYMERIZATION AND DEPOSITION IN RF (RADIO-FREQUENCY) DISCHARGES [J].
DAGOSTINO, R ;
CAPEZZUTO, P ;
BRUNO, G ;
CRAMAROSSA, F .
PURE AND APPLIED CHEMISTRY, 1985, 57 (09) :1287-1298
[4]   INFRARED DIODE-LASER SPECTRUM OF THE NU-1 BAND OF CF2(X1A1) [J].
DAVIES, PB ;
LEWISBEVAN, W ;
RUSSELL, DK .
JOURNAL OF CHEMICAL PHYSICS, 1981, 75 (12) :5602-5608
[5]   ETCH MECHANISM IN THE REACTIVE ION ETCHING OF SILICON-NITRIDE [J].
DULAK, J ;
HOWARD, BJ ;
STEINBRUCHEL, C .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (03) :775-778
[6]   SELECTIVE ETCHING OF SILICON DIOXIDE USING REACTIVE ION ETCHING WITH CF4-H2 [J].
EPHRATH, LM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) :1419-1421
[7]   CROSS-SECTION MEASUREMENTS FOR ELECTRON-IMPACT DISSOCIATION OF CHF3 INTO NEUTRAL AND IONIC RADICALS [J].
GOTO, M ;
NAKAMURA, K ;
TOYODA, H ;
SUGAI, H .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (6A) :3602-3607
[8]   FREE-RADICALS IN AN INDUCTIVELY-COUPLED ETCHING PLASMA [J].
HIKOSAKA, Y ;
NAKAMURA, M ;
SUGAI, H .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (4B) :2157-2163
[9]   DRASTIC CHANGE IN CF-2 AND CF-3 KINETICS INDUCED BY HYDROGEN ADDITION INTO CF-4 ETCHING PLASMA [J].
HIKOSAKA, Y ;
TOYODA, H ;
SUGAI, H .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1993, 32 (5A) :L690-L693
[10]   FLUOROCARBON HIGH-DENSITY PLASMA .5. INFLUENCE OF ASPECT RATIO ON THE ETCH RATE OF SILICON DIOXIDE IN AN ELECTRON-CYCLOTRON-RESONANCE PLASMA [J].
JOUBERT, O ;
OEHRLEIN, GS ;
ZHANG, Y .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (03) :658-664