Microphotoluminescence mapping of packaging-induced stress distribution in high-power AlGaAs laser diodes

被引:35
作者
Martin, E
Landesman, JP
Hirtz, JP
Fily, A
机构
[1] Escuela Tecn Super Ingenieros Ind, Dept Fis Mat Condensada, Valladolid 47011, Spain
[2] Thomson CSF, Cent Rech Lab, F-91404 Orsay, France
[3] Thomson CSF, Laser Diodes, F-91404 Orsay, France
关键词
D O I
10.1063/1.125064
中图分类号
O59 [应用物理学];
学科分类号
摘要
Spatially resolved photoluminescence line scans were performed to determine the local stresses in AlGaAs laser diodes designed for high-power operation at 808 nm. In this approach, the sign and magnitude of the local stress are deduced from the spectral shift of the peak associated with band-to-band transitions in the n-type GaAs substrate. The sensitivity of the technique (minimal equivalent hydrostatic stress that can be detected) can reach 10 MPa or better. Correlations between solder-induced stress distribution in the devices and estimated lifetimes are demonstrated. (C) 1999 American Institute of Physics. [S0003-6951(99)01243-7].
引用
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页码:2521 / 2523
页数:3
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