Effects of processing parameters on the properties of tantalum nitride thin films deposited by reactive sputtering

被引：41

作者：

Nazon, J. ^{[1
]}

Sarradin, J. ^{[1
]}

Flaud, V. ^{[1
]}

Tedenac, J. C. ^{[1
]}

Frety, N. ^{[1
]}

机构：

[1] Inst Charles Gerhardt, UMR CNRS UM2 ENSCM UM1 5253, F-34095 Montpellier 5, France

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2008年 / 464卷 / 1-2期

关键词：

nitride materials; thin films; vapour deposition; microstructure; X-ray diffraction;

D O I：

10.1016/j.jallcom.2007.10.027

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The effects of processing parameters on the properties of tantalum nitride thin films deposited by radio frequency reactive sputtering have been investigated. The influence of the N-2 partial and (Ar+ N-2) total gas pressures as well as the sputtering power on the microstructure and electrical properties is reported. Rising the N-2 partial pressure, from 2 to 10.7%, induces a change in the composition of the delta-TaN phase, from TaN to TaN1.13. This composition change is associated with a drastic increase of the electrical resistivity over a 7.3% N-2 partial pressure. The total gas pressure is revealed to strongly affect the film microstructure since a variation in both composition and grain size is observed when the gas pressure rises from 6.8 to 24.6 Pa. When the sputtering power varied between 50 and 110 W. an increase of the grain size related to a decrease of the electrical resistivity is observed. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：526 / 531

页数：6

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