CMOS photonics for high-speed interconnects

被引：368

作者：

Gunn, C

机构：

来源：

IEEE MICRO | 2006年 / 26卷 / 02期

关键词：

D O I：

10.1109/MM.2006.32

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

For the first time, high-speed optical communications directly between silicon die are possible at a price-performance point competitive with traditional electrical interconnects.

引用

页码：58 / 66

页数：9

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