Evidence of oxygen bubbles formed within anodic films on aluminium-copper alloys

被引:88
作者
Skeldon, P
Thompson, GE
Wood, GC
Zhou, X
Habazaki, H
Shimizu, K
机构
[1] TOHOKU UNIV,INST MAT RES,AOBA KU,SENDAI,MIYAGI 980,JAPAN
[2] KEIO UNIV,CHEM LAB,YOKOHAMA,KANAGAWA 223,JAPAN
来源
PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES | 1997年 / 76卷 / 04期
基金
英国工程与自然科学研究理事会;
关键词
D O I
10.1080/01418619708214206
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The composition of the barrier anodic film formed at 50 Am-2 to 200 V on solution-treated Al-1 at.% Cu alloy in ammonium pentaborate electrolyte at 293 K has been investigated by Rutherford backscattering spectroscopy and nuclear reaction analysis. The film contains about 14% more oxygen in comparison with that expected for an anodic alumina film as usually formed on high purity aluminium under similar conditions. The excess oxygen is attributed to the electrochemical production of oxygen near the alloy-film interface during growth of the firm. The formation of the oxygen is probably linked to the oxidation of copper in a thin alloy layer, highly enriched in copper, immediately beneath the anodic him. Most of the oxygen appears to reside in bubbles, of dimensions from about 5 to 250 nm, within the inner part of the film, which are revealed in the transmission electron microscope. The estimated pressure of the oxygen gas within the bubbles is approximate to 150 MPa.
引用
收藏
页码:729 / 741
页数:13
相关论文
共 26 条
[1]   PRECISION ABSOLUTE THIN-FILM STANDARD REFERENCE TARGETS FOR NUCLEAR-REACTION MICROANALYSIS OF OXYGEN ISOTOPES .1. O-16 STANDARDS [J].
AMSEL, G ;
NADAI, JP ;
ORTEGA, C ;
RIGO, S ;
SIEJKA, J .
NUCLEAR INSTRUMENTS & METHODS, 1978, 149 (1-3) :705-712
[2]  
AMSEL G, 1967, ANAL CHEM, V39, P1687
[3]   USE OF RUTHERFORD BACKSCATTERING TO STUDY BEHAVIOR OF ION-IMPLANTED ATOMS DURING ANODIC-OXIDATION OF ALUMINUM - AR, KR, XE, K, RB, CS, CL, BR, AND I [J].
BROWN, F ;
MACKINTOSH, WD .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (08) :1096-1102
[5]   The importance of surface treatment to the anodic oxidation behaviour of Al-Cu alloys [J].
Habazaki, H ;
Paez, MA ;
Shimizu, K ;
Skeldon, P ;
Thompson, GE ;
Wood, GC ;
Zhou, X .
CORROSION SCIENCE, 1996, 38 (07) :1033-1042
[6]   The incorporation of metal ions into anodic films on aluminium alloys [J].
Habazaki, H ;
Shimizu, K ;
Skeldon, P ;
Thompson, GE ;
Wood, GC .
PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANICS ELECTRONIC OPTICAL AND MAGNETIC PROPERTIES, 1996, 73 (03) :445-460
[7]   Oxidation of copper and mobility of copper ions during anodizing of an Al-1.5 wt.% Cu alloy [J].
Habazaki, H ;
Shimizu, K ;
Paez, MA ;
Skeldon, P ;
Thompson, GE ;
Wood, GC ;
Xhou, X .
SURFACE AND INTERFACE ANALYSIS, 1995, 23 (13) :892-898
[8]  
HABAZAKI H, 1996, IN PRESS CORROS SCI
[9]  
HABAZAKI H, 1996, IN PRESS ELECTROCHIM
[10]  
HABAZAKI H, 1996, IN PRESS THIN SOLID