Compliant substrate processes

被引:2
作者
Doolittle, WA [1 ]
Brown, AS [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源
EPITAXIAL GROWTH-PRINCIPLES AND APPLICATIONS | 1999年 / 570卷
关键词
D O I
10.1557/PROC-570-225
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Recent results indicate that compliant substrates offer significant promise as a new approach for strain management in semiconductors. The potential applications include 1) the growth of device-quality highly mismatched materials on dissimilar substrates, and 2) the lateral control of material properties resulting from the effects of strain on bandstructure and/or growth dynamics. A significant amount of research in this area is dedicated to the reduction of extrinsic processing effects resulting from compliant substrate fabrication, and the development of simple models for understanding the observed reduction in defect density and/or strain in the epitaxial films grown on compliant substrates. A recent focus in our work has been on the growth of GaN on a novel and easily removable substrate -lithium gallate- for the regrowth on a bonded GaN template. The first step in this approach is the optimization of the growth of GaN on lithium gallate. In addition, this approach requires the use of an appropriate bonding layer to reduce the strain or defect production during growth due to coefficient of thermal expansion mismatches between the GaN sample and the handle wafer. Our work in this area will be highlighted in the context of an overview of various compliant substrate approaches and current results that indicate their efficacy.
引用
收藏
页码:225 / 234
页数:10
相关论文
共 30 条
[1]   Compliant substrate technology: Status and prospects [J].
Brown, AS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (04) :2308-2312
[2]   Strain accommodation in mismatched layers by molecular beam epitaxy: Introduction of a new compliant substrate technology [J].
CarterComan, C ;
Brown, AS ;
Jokerst, NM ;
Dawson, DE ;
BicknellTassius, R ;
Feng, ZC ;
Rajkumar, KC ;
Dagnall, G .
JOURNAL OF ELECTRONIC MATERIALS, 1996, 25 (07) :1044-1048
[3]   Analysis of In0.07Ga0.93As layers on GaAs compliant substrates by double crystal x-ray diffraction [J].
CarterComan, C ;
BicknellTassius, R ;
Brown, AS ;
Jokerst, NM .
APPLIED PHYSICS LETTERS, 1997, 70 (13) :1754-1756
[4]  
Cheng TS, 1996, SEMICONDUCTORS+, V30, P603
[5]  
DOOLITTLE WA, 1997, P MAT RES SOC FALL B
[6]  
DOOLITTLE WA, 1998, J VAC SCI TECH B MAY
[7]  
DOOLITTLE WA, 1998, J ELECT MAT, V27
[8]  
Edgar J.H., 1994, Properties of Group III Nitrides
[9]   Dislocation-free InSb grown on GaAs compliant universal substrates [J].
Ejeckam, FE ;
Seaford, ML ;
Lo, YH ;
Hou, HQ ;
Hammons, BE .
APPLIED PHYSICS LETTERS, 1997, 71 (06) :776-778
[10]   Critical thickness condition for a strained compliant substrate/epitaxial film system [J].
Freund, LB ;
Nix, WD .
APPLIED PHYSICS LETTERS, 1996, 69 (02) :173-175