Sterilization effects of atmospheric cold plasma brush

被引:66
作者
Yu, QS [1 ]
Huang, C
Hsieh, FH
Huff, H
Duan, YX
机构
[1] Univ Missouri, Ctr Surface Sci & Plasma Technol, Columbia, MO 65211 USA
[2] Univ Missouri, Dept Chem Engn, Columbia, MO 65211 USA
[3] Univ Missouri, Dept Biol Engn, Columbia, MO 65211 USA
[4] Los Alamos Natl Lab, Los Alamos, NM 87545 USA
关键词
D O I
10.1063/1.2161807
中图分类号
O59 [应用物理学];
学科分类号
摘要
This study investigated the sterilization effects of a brush-shaped plasma created at one atmospheric pressure. A population of 1.0x10(4)-1.0x10(5) Escherichia coli or Micrococcus luteus bacteria was seeded in filter paper media and then subjected to Ar and/or Ar+O-2 plasmas. A complete kill of the Micrococcus luteus required about 3 min argon plasma exposures. With oxygen addition into the argon plasma gas streams, a complete kill of the bacteria needed only less than 1 min plasma exposure for Micrococcus luteus and about 2 min exposure for Escherichia coli. The plasma treatment effects on the different bacteria cell structures were examined using scanning electron microscopy. (c) 2006 American Institute of Physics.
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页数:3
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共 16 条
[11]   The respective roles of UV photons and oxygen atoms in plasma sterilization at reduced gas pressure:: The case of N2-O2 mixtures [J].
Philip, N ;
Saoudi, B ;
Crevier, MC ;
Moisan, M ;
Barbeau, J ;
Pelletier, J .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2002, 30 (04) :1429-1436
[12]   The atmospheric-pressure plasma jet:: A review and comparison to other plasma sources [J].
Schütze, A ;
Jeong, JY ;
Babayan, SE ;
Park, J ;
Selwyn, GS ;
Hicks, RF .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 1998, 26 (06) :1685-1694
[13]   Direct current high-pressure glow discharges [J].
Stark, RH ;
Schoenbach, KH .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (04) :2075-2080
[14]  
Yu QS, 1998, J POLYM SCI POL CHEM, V36, P1583, DOI 10.1002/(SICI)1099-0518(19980730)36:10<1583::AID-POLA10>3.0.CO
[15]  
2-C
[16]   An optical emission study on expanding low-temperature cascade arc plasmas [J].
Yu, QS ;
Yasuda, HK .
PLASMA CHEMISTRY AND PLASMA PROCESSING, 1998, 18 (04) :461-485