Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

被引：82

作者：

Chiu, SH

Shao, TL

Chen, C ^{[1
]}

Yao, DJ

Hsu, CY

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan

[2] Natl Tsing Hua Univ, Inst Microelectromech Syst, Hsinchu 300, Taiwan

[3] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 300, Taiwan

来源：

APPLIED PHYSICS LETTERS | 2006年 / 88卷 / 02期

关键词：

D O I：

10.1063/1.2151255

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Joule heating effect in solder joints was investigated using thermal infrared microscopy and modeling in this study. With the increase of applied current, the temperature increased rapidly due to Joule heating. Furthermore, modeling results indicated that a hot spot existed in the solder near the entrance point of the Al trace, and it became more pronounced as the applied current increased. The temperature difference between the hot spot and the solder was as large as 9.4 degrees C when the solder joint was powered by 0.8 A. This hot spot may play an important role in the initial void formation during electromigration.

引用

页码：1 / 3

页数：3

共 12 条

[1]

*ASS PACK SECT SEM, 2003, INT TECHN ROADM SEM, P4

[2]

BRANDENBURG S, 1998, P SURF MOUNT INT C E, P337

[3] Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization [J].