Low temperature zirconia thin film synthesis by a chemical vapour deposition process involving ZrCl4 and O-2-H-2-Ar microwave post-discharges. Comparison with a conventional CVD hydrolysis process

被引:11
作者
Gavillet, J
Belmonte, T
Hertz, D
Michel, H
机构
[1] ECOLE MINES,LAB SCI & GENIE SURF,URA CNRS 1402,F-54042 NANCY,FRANCE
[2] FRAMATOME FRANCE,F-69456 LYON 06,FRANCE
关键词
coatings; plasma processing and deposition; chemical vapour deposition; oxides;
D O I
10.1016/S0040-6090(96)09526-0
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thin films of zirconia have been deposited at 733 K and below by microwave post-discharge-assisted oxidation of ZrCl4 in O-2-H-2-Ar mixtures, leading to monoclinic layers with a columnar morphology. The highest deposition rates were obtained when both H-2 and O-2 passed through the discharge, with a flowrate ratio of H-2/O-2 = 2. The results have been compared with those for a conventional chemical vapour deposition (CVD) process based on the hydrolysis of ZrCl4. Together with information gained on the post-discharge process using other investigation methods, such as mass spectrometry and measurements of atomic oxygen concentrations by NO titration, they have helped to shed light on the reaction paths. The mechanism leading to zirconia formation has been identified as being a simple hydrolysis reaction in the late post-discharge. The microwave post-discharge-assisted O-2-H-2-Ar process thus seems to behave like a conventional CVD technique in the temperature range from 573 to 733 K.
引用
收藏
页码:35 / 44
页数:10
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