A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems

被引：61

作者：

Oh, KW

Han, A

Bhansali, S

Ahn, CH

机构：

[1] Samsung Adv Inst Technol, MEMS Lab, Biochip Project Team, Suwon 440600, South Korea

[2] Univ Cincinnati, Dept Elect & Comp Engn & Comp Sci, Microsyst & BioMEMS Lab, Cincinnati, OH 45221 USA

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2002年 / 12卷 / 02期

关键词：

D O I：

10.1088/0960-1317/12/2/313

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new low-temperature biochemically compatible polymer bonding process has been successfully developed. The bonding has been characterized for bond strength and chemical resistance. This technique has successfully addressed a major challenge in the development of microfluidic systems from discrete components by enabling the bonding of the components to the microfluidic motherboards at low temperatures and ensuring reliable, leak-proof and chemically inert bonding. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer. The bonding technique lowers the bonding temperature (similar to160 degreesC), shows a good bond strength of 4.3 MPa in silicon-to-silicon, and has excellent chemical resistance to various chemicals used in microelectromechanical systems processing.

引用

页码：187 / 191

页数：5

共 10 条

[1]

AHN CH, 1998, P MICR TOT AN SYST 9, P225

[2]

*AS GLASS CO LTD, 1997, CYTOP TECHN REP

[3] Rapid prototyping of microfluidic systems in poly(dimethylsiloxane) [J].

Duffy, DC ;

McDonald, JC ;

Schueller, OJA ;

Whitesides, GM .

ANALYTICAL CHEMISTRY, 1998, 70 (23) :4974-4984

[4]

FAN Z, 1998, SOL STAT SENS ACT WO, P97

[5]

HANNEBORG A, 1990, MICR EUR 2 WORKSH MI

[6] Low temperature nafion bonding of silicon wafers [J].

Ilic, B ;

Neuzil, P ;

Stanczyk, T ;

Czaplewski, D ;

Maclay, GJ .

ELECTROCHEMICAL AND SOLID STATE LETTERS, 1999, 2 (02) :86-87

[7] Studies on SiO2-SiO2 bonding with hydrofluoric acid - Room temperature and low stress bonding technique for MEMS [J].

Nakanishi, H ;

Nishimoto, T ;

Nakamura, R ;

Yotsumoto, A ;

Shoji, S .

MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, :609-614

[8] LOW-TEMPERATURE SILICON-WAFER BONDING [J].

QUENZER, HJ ;

BENECKE, W .

SENSORS AND ACTUATORS A-PHYSICAL, 1992, 32 (1-3) :340-344

[9]

Sadler D.J., 1999, P 10 INT C SOL STAT, P1812

[10]

Takao H, 1997, TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P1173, DOI 10.1109/SENSOR.1997.635414

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