Performance optimization of VLSI interconnect layout

被引:155
作者
Cong, J
He, L
Koh, CK
Madden, PH
机构
[1] Department of Computer Science, Sch. of Eng. and Applied Science, University of California, Los Angeles
基金
美国国家科学基金会;
关键词
D O I
10.1016/S0167-9260(96)00008-9
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper presents a comprehensive survey of existing techniques for interconnect optimization during the VLSI physical design process, with emphasis on recent studies on interconnect design and optimization for high-performance VLSI circuit design under the deep submicron fabrication technologies. First, we present a number of interconnect delay models and driver/gate delay models of various degrees of accuracy and efficiency which are most useful to guide the circuit design and interconnect optimization process. Then, we classify the existing work on optimization of VLSI interconnect into the following three categories and discuss the results in each category in detail: (i) topology optimization for highperformance interconnects, including the algorithms for total wire length minimization, critical path length minimization, and delay minimization; (ii) device and interconnect sizing, including techniques for efficient driver, gate, and transistor sizing, optimal wire sizing, and simultaneous topology construction, buffer insertion, buffer and wire sizing; (iii) high-performance clock routing, including abstract clock net topology generation and embedding, planar clock routing, buffer and wire sizing for clock nets, non-tree clock routing, and clock schedule optimization. For each method, we discuss its effectiveness, its advantages and limitations, as well as its computational efficiency. We group the related techniques according to either their optimization techniques or optimization objectives so that the reader can easily compare the quality and efficiency of different solutions.
引用
收藏
页码:1 / 94
页数:94
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