Strain rate sensitivity of a nanocrystalline Cu synthesized by electric brush plating

被引：92

作者：

Jiang, ZH ^{[1
]}

Liu, XL ^{[1
]}

Li, GY ^{[1
]}

Jiang, Q ^{[1
]}

Lian, JS ^{[1
]}

机构：

[1] Jilin Univ, Coll Mat Sci & Engn, Key Lab Automobile Mat, Changchun 130025, Peoples R China

来源：

APPLIED PHYSICS LETTERS | 2006年 / 88卷 / 14期

关键词：

D O I：

10.1063/1.2193467

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A method for synthesizing bulk nanocrystalline Cu by an electric brush-plating technique is reported. This brush-plated nanocrystalline Cu has a fine (26 nm) and quite uniform grain structure and predominant high-angle grain boundaries. A pronounced strain rate sensitivity of the stress with an m of 0.104 and the Coble creep and a subsequent transition to the power-law creep were observed in room temperature tensile and creep tests. The dominant grain boundary deformation due to the truly nanocrystalline structure of this nanocrystalline Cu is responsible for the observed strain rate sensitivity.

引用

页数：3

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