Stress and morphology evolution during island growth

被引:44
作者
Pao, CW [1 ]
Srolovitz, DJ
机构
[1] Princeton Univ, Dept Mech & Aerosp Engn, Princeton, NJ 08544 USA
[2] Princeton Univ, Princeton Inst Sci & Technol Mat, Princeton, NJ 08544 USA
关键词
D O I
10.1103/PhysRevLett.96.186103
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
We performed a series of hybrid molecular-dynamics simulations of island growth on a substrate and monitored island stress evolution for several different island/substrate interfacial energies. Smaller (larger) interfacial energy yields islands with a stronger (weaker) compressive stress-thickness product. We present analytical results that suggest that the stress-thickness product is a linear function of the substrate coverage, with slope equal to minus the substrate surface stress, if the island is in mechanical equilibrium, and verify these results with simulation data.
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页数:4
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共 17 条
[1]   THE INTERNAL-STRESS IN THIN SILVER, COPPER AND GOLD-FILMS [J].
ABERMANN, R ;
KOCH, R .
THIN SOLID FILMS, 1985, 129 (1-2) :71-78
[2]   STRUCTURE AND INTERNAL-STRESS IN ULTRATHIN SILVER FILMS DEPOSITED ON MGF2 AND SIO SUBSTRATES [J].
ABERMANN, R ;
KRAMER, R ;
MASER, J .
THIN SOLID FILMS, 1978, 52 (02) :215-229
[3]   An atomistic study of solid/liquid interfaces in binary systems [J].
Baskes, MI .
JOM, 2004, 56 (04) :45-48
[4]   Many-body effects in fcc metals: A Lennard-Jones embedded-atom potential [J].
Baskes, MI .
PHYSICAL REVIEW LETTERS, 1999, 83 (13) :2592-2595
[5]   Surface stress model for intrinsic stresses in thin films [J].
Cammarata, RC ;
Trimble, TM ;
Srolovitz, DJ .
JOURNAL OF MATERIALS RESEARCH, 2000, 15 (11) :2468-2474
[6]   Origin of compressive residual stress in polycrystalline thin films [J].
Chason, E ;
Sheldon, BW ;
Freund, LB ;
Floro, JA ;
Hearne, SJ .
PHYSICAL REVIEW LETTERS, 2002, 88 (15) :4
[7]   SEMIEMPIRICAL, QUANTUM-MECHANICAL CALCULATION OF HYDROGEN EMBRITTLEMENT IN METALS [J].
DAW, MS ;
BASKES, MI .
PHYSICAL REVIEW LETTERS, 1983, 50 (17) :1285-1288
[8]   The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films [J].
Floro, JA ;
Hearne, SJ ;
Hunter, JA ;
Kotula, P ;
Chason, E ;
Seel, SC ;
Thompson, CV .
JOURNAL OF APPLIED PHYSICS, 2001, 89 (09) :4886-4897
[9]   Correlation of stress and atomic-scale surface roughness evolution during intermittent homoepitaxial growth of (111)-oriented Ag and Cu [J].
Friesen, C ;
Thompson, CV .
PHYSICAL REVIEW LETTERS, 2004, 93 (05) :056104-1
[10]   Reversible stress relaxation during precoalescence interruptions of Volmer-Weber thin film growth [J].
Friesen, C ;
Thompson, CV .
PHYSICAL REVIEW LETTERS, 2002, 89 (12) :126103-126103