High-κ/metal-gate stack and its MOSFET characteristics

被引:378
作者
Chau, R [1 ]
Datta, S [1 ]
Doczy, M [1 ]
Doyle, B [1 ]
Kavalieros, J [1 ]
Metz, M [1 ]
机构
[1] Intel Corp, Log Technol Dev, Components Res, Hillsboro, OR 97124 USA
关键词
atomic layer deposition (ALD); CMOS transistors; Hafnium Oxide (HfO2); high-kappa dielectric; metal-gate electrode; remote phonons;
D O I
10.1109/LED.2004.828570
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We show experimental evidence of surface phonon scattering in the high-kappa dielectric being the primary cause of channel electron mobility degradation. Next, we show that midgap TiN metal-gate electrode is effective in screening phonon scattering in the high-kappa dielectric from coupling to the channel under inversion conditions, resulting in improved channel electron mobility. We then show that other metal-gate electrodes, such as the ones with n+ and p+ work functions, are also effective in improving channel mobilities to close to those of the conventional SiO2/poly-Si stack. Finally, we demonstrate this mobility degradation recovery translates directly into high drive performance on high-kappa/metal-gate CMOS transistors with desirable threshold voltages.
引用
收藏
页码:408 / 410
页数:3
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