Polypyrrole-based conducting hot melt adhesives for EMI shielding applications

被引：101

作者：

Pomposo, JA ^{[1
]}

Rodríguez, J ^{[1
]}

Grande, H ^{[1
]}

机构：

[1] CIDETEC, Ctr Electrochem REs & Dev, E-20009 San Sebastian, Spain

来源：

SYNTHETIC METALS | 1999年 / 104卷 / 02期

关键词：

EMI shielding; hot melt adhesives; polypyrrole;

D O I：

10.1016/S0379-6779(99)00061-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Intrinsically conducting hot melt adhesives (ICHMAs) have been developed, based on polypyrrole (PPB) blends, for use in electronic and telecommunication applications requiring shielding against electromagnetic interference (EMI). These advanced materials have been formulated to exhibit significant EMI shielding effectiveness (SE) while retaining the superior properties of conventional hot melt adhesives. The conductivity properties, adhesion characteristics and both near- and far-field EMI SE behaviour of these ICHMAs at room temperature are investigated as a function of PPy content. The environmental stability of the conductivity is also reported. Potential use of such new materials in current and future electronic applications is anticipated. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：107 / 111

页数：5

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