TMA, DMA, DSC and TGA of lead free solders

被引：14

作者：

Lau, JH ^{[1
]}

Chang, C ^{[1
]}

机构：

[1] Express Packaging Syst Inc, Palo Alto, CA USA

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 1999年 / 11卷 / 02期

关键词：

analysis; electronics packaging; solder;

D O I：

10.1108/09540919910265640

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

Most of the electronics packaging materials, especially solders, are temperature dependent temperature-dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimetry), and TGA (thermogravimetric analysis). In this study, the thermal coefficient of expansion (TCE), storage modulus, moisture uptake, and melting point of two lead free solders, 96.5wt%Sn-3.5wt%Ag and 42wt%Sn-58wt%Bi provided from two different vendors, are measured by, respectively, TMA, DMA, TGA, and DSC. For comparison purpose, the 63wt%Sn37wt%Pb solder is also considered.

引用

页码：17 / 24

页数：8

共 35 条

[1]

BIOCCA P, 1998, P SURF MOUNT INT C A, P705

[2]

DARVEAUX R, 1992, P ELECTR C, P538, DOI 10.1109/ECTC.1992.204257

[3]

FELTON LE, 1993, J MET, V45, P14

[4]

The mechanical behavior of interconnect materials for electronic packaging [J].

Frear, DR .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1996, 48 (05) :49-53

[5]

FREAR DR, 1994, MECH SOLDER ALLOY IN

[6]

MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF PB-FREE SOLDER ALLOYS FOR LOW-COST ELECTRONIC ASSEMBLY - A REVIEW [J].

GLAZER, J .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :693-700

[7]

GRUSD A, 1998, P SURF MOUNT INT C A, P648

[8]

HUMPSTON G, 1993, PRINCIPLE SOLDERING

[9]

Hwang J.S., 1989, SOLDER PASTE ELECT P

[10]

Hwang JS., 1996, Modern Solder Technology for Competitive Electronics Manufacturing

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