Advances in mesoscale thermal management technologies for microelectronics

被引：159

作者：

Garimella, Suresh V. ^{[1
]}

机构：

[1] Purdue Univ, Sch Mech Engn, Cooling Technol Res Ctr, W Lafayette, IN 47907 USA

来源：

MICROELECTRONICS JOURNAL | 2006年 / 37卷 / 11期

基金：

美国国家科学基金会;

关键词：

mesoscale; thermal management; microelctronics;

D O I：

10.1016/j.mejo.2005.07.017

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents recent advances in a number of novel, high-performance cooling techniques for emerging electronics applications Critical enabling thermal management technologies covered include microchannel transport and micropumps, jet impingement, miniatur flat heat pipes, transient phase change energy storage systems, piezoelectric fans, and prediction of interface contact conductance. (c) 2005 Elsevier Ltd. All rights reserved.

引用

页码：1165 / 1185

页数：21

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