Reduced temperature sensitivity of the wavelength of a diode laser in a stress-engineered hydrostatic package

被引:12
作者
Cohen, DA
Heimbuch, ME
Coldren, LA
机构
[1] Dept. of Elec. and Comp. Engineering, University of California, Santa Barbara
关键词
D O I
10.1063/1.118137
中图分类号
O59 [应用物理学];
学科分类号
摘要
By using the effects of increasing hydrostatic pressure to counteract the effects of rising temperature, we demonstrate a technique to stabilize the wavelength of an uncooled diode laser. We use the differential thermal expansion between various materials incorporated into the laser package to automatically generate a temperature-dependent pressure, and obtain a 50% reduction in the temperature sensitivity of the wavelength of a 1.55 mu m GaInAsP/InP laser. (C) 1996 American Institute of Physics.
引用
收藏
页码:455 / 457
页数:3
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