Urea-formaldehyde resins characterized by thermal analysis and FTIR method

被引:114
作者
Zorba, T. [1 ]
Papadopoulou, E. [2 ]
Hatjiissaak, A. [2 ]
Paraskevopoulos, K. M. [1 ]
Chrissafis, K. [1 ]
机构
[1] Aristotle Univ Thessaloniki, Sch Phys, Dept Solid State Phys, Thessaloniki 54124, Greece
[2] Chimar Hellas SA, Thessaloniki 55131, Greece
关键词
DSC; FTIR; TG-DTA; urea-formaldehyde (UF) resin;
D O I
10.1007/s10973-007-8731-2
中图分类号
O414.1 [热力学];
学科分类号
摘要
Urea-formaldehyde (UF) resins are the most used polycondensation resins today, in manufacturing particleboards. UF resins possess some advantages such as fast curing, good performance in the panel, water solubility and low price. However, the main chemical bonds of the UF resins macromolecules are hydrolysis sensitive. This causes low water and moisture resistance performance and subsequent formaldehyde release from the UF-bonded panels. A multitude of pathways have been explored for the improvement of UF resins' behavior relating either to their synthesis procedure or application parameters during panel manufacture. In this study, two UF resins (a conventional and an innovative one produced at very low pH and temperature conditions) were analyzed for their specifications and characterized with TG-DTA technique in dynamic heating conditions and FTIR measurements both in their pre-polymer and cured state.
引用
收藏
页码:29 / 33
页数:5
相关论文
共 13 条
[1]   MECHANISM OF THERMAL-DEGRADATION OF UREA-FORMALDEHYDE POLYCONDENSATES [J].
CAMINO, G ;
OPERTI, L ;
TROSSARELLI, L .
POLYMER DEGRADATION AND STABILITY, 1983, 5 (03) :161-172
[2]   Urea-formaldehyde (UF) adhesive resins for wood [J].
Dunky, M .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1998, 18 (02) :95-107
[3]   DIFFERENTIAL SCANNING CALORIMETRY AND DYNAMIC-MECHANICAL ANALYSIS OF AMINE-MODIFIED UREA-FORMALDEHYDE ADHESIVES [J].
EBEWELE, RO .
JOURNAL OF APPLIED POLYMER SCIENCE, 1995, 58 (10) :1689-1700
[4]   THE STRUCTURE OF UREA-FORMALDEHYDE RESINS [J].
JADA, SS .
JOURNAL OF APPLIED POLYMER SCIENCE, 1988, 35 (06) :1573-1592
[5]   Differential scanning calorimetry of urea-formaldehyde adhesive resins, synthesized under different pH conditions [J].
Park, BD ;
Kang, EC ;
Park, JY .
JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 100 (01) :422-427
[6]   Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea-formaldehyde resin and properties of particleboard [J].
Park, Byung-Dae ;
Kang, Eun Chang ;
Park, Jong Yong .
JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 101 (03) :1787-1792
[7]   Effect of alkylresorcinols on curing behaviour of phenol-formaldehyde resol resin [J].
Siimer, K. ;
Kaljuvee, T. ;
Christjanson, P. ;
Pehk, T. ;
Saks, I. .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2008, 91 (02) :365-373
[8]   Curing of urea-formaldehyde resins on a wood substrate [J].
Siimer, K ;
Kaljuvee, T ;
Christjanson, P ;
Lasn, I .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2006, 84 (01) :71-77
[9]   Changes in curing behaviour of aminoresins during storage [J].
Siimer, K ;
Kaljuvee, T ;
Christjanson, P ;
Pehk, T .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2005, 80 (01) :123-130
[10]   Thermal behaviour of urea-formaldehyde resins during curing [J].
Siimer, K ;
Kaljuvee, T ;
Christjanson, P .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2003, 72 (02) :607-617