Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder

被引：13

作者：

Chang, TC

Hon, MH

Wang, MC

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

[2] Natl Kaohsiung Univ Appl Sci, Dept Mech Engn, Kaohsiung 80782, Taiwan

来源：

MATERIALS RESEARCH BULLETIN | 2003年 / 38卷 / 05期

关键词：

intermetallic compounds; alloy; X-ray diffraction; interface;

D O I：

10.1016/S0025-5408(03)00024-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The intermetallic compounds (IMCs) formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder alloy have been investigated by X-ray diffraction (XRD), transmission electron microscopy (TEM) and electron diffraction (ED). The XRD patterns show that the main IMCs formed at the interface of Sn-9Zn-0.5Ag/Cu are gamma-Cu5Zn8 and eta'-Cu6Sn5. The Ag3Sn IMC with orthorhombic structure was also observed at the Sn-9Zn-0.5Ag/Cu interface by TEM and ED analyses. The interfacial adhesion strength between the Cu substrate and Sn-9Zn-0.5Ag lead-free solder alloy is higher than that of the Sn-9Zn alloy due to the formation of Ag3Sn IMC at the interface. (C) 2003 Elsevier Science Ltd. All rights reserved.

引用

页码：909 / 916

页数：8

共 21 条

[1] Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints [J].