The formation of Ge nanocrystals in a metal-insulator-semiconductor structure and its memory effect

被引:17
作者
Heng, CL
Liu, YJ
Wee, ATS
Finstad, TG
机构
[1] Univ Oslo, Dept Phys, Phys Elect Grp, N-0316 Oslo, Norway
[2] Singapore MIT Alliance, Singapore 117576, Singapore
[3] Natl Univ Singapore, Dept Phys, Singapore 117548, Singapore
关键词
electron-beam evaporation; Ge nanocrystals; rapid thermal annealing; memory effect;
D O I
10.1016/j.jcrysgro.2003.10.068
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
After rapid thermal annealing of an ultra-thin germanium (Ge) layer in a tri-layer insulator structure at 1000degreesC in argon, the formation of Ge nanocrystals in the structure has been investigated by using high-resolution transmission electron microscopy, X-ray photoelectron spectroscopy and atomic force microscopy. It was found that the Ge layer in the as prepared sample is a mixture of amorphous Ge, GeO2 and Ge suboxide. After 10 s annealing, Ge is distributed over a much wider amorphous layer than the as prepared case and a few Ge nanocrystals were observed. The density of Ge nanocrystals increases with increasing annealing time from 10 to 200 s, and then decreases as the time increases further to 400 s. A possible mechanism for the formation of Ge nanocrystals was discussed. Current-voltage and capacitance-voltage measurements show that the device with Ge nanocrystals has a pronounced charge storage capability. The electrical charge stored in the device reaches a maximum value when the annealing time increases from 10 to 200 s, and then decreases as the annealing time increases further to 400 s. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:95 / 104
页数:10
相关论文
共 18 条
[1]   Observation of memory effect in germanium nanocrystals embedded in an amorphous silicon oxide matrix of a metal-insulator-semiconductor structure [J].
Choi, WK ;
Chim, WK ;
Heng, CL ;
Teo, LW ;
Ho, V ;
Ng, V ;
Antoniadis, DA ;
Fitzgerald, EA .
APPLIED PHYSICS LETTERS, 2002, 80 (11) :2014-2016
[2]   Microstructural and photoluminescence studies of germanium nanocrystals in amorphous silicon oxide films [J].
Choi, WK ;
Ho, YW ;
Ng, SP ;
Ng, V .
JOURNAL OF APPLIED PHYSICS, 2001, 89 (04) :2168-2172
[3]   Growth and characterization of Ge nanocrystals in ultrathin SiO2 films [J].
Fukuda, H ;
Kobayashi, T ;
Endoh, T ;
Nomura, S ;
Sakai, A ;
Ueda, Y .
APPLIED SURFACE SCIENCE, 1998, 130 :776-780
[4]   Physical and electrical properties of Ge-implanted SiO2 films [J].
Fukuda, H ;
Sakuma, S ;
Yamada, T ;
Nomura, S ;
Nishino, M ;
Higuchi, T ;
Ohshima, S .
JOURNAL OF APPLIED PHYSICS, 2001, 90 (07) :3524-3528
[5]   Precipitation, ripening and chemical effects during annealing of Ge+ implanted SiO2 layers [J].
Heinig, KH ;
Schmidt, B ;
Markwitz, A ;
Grötzschel, R ;
Strobel, M ;
Oswald, S .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1999, 148 (1-4) :969-974
[6]   Single electron tunneling through Ge nanocrystal fabricated by cosputtering method [J].
Inoue, Y ;
Fujii, M ;
Hayashi, S ;
Yamamoto, K .
SOLID-STATE ELECTRONICS, 1998, 42 (7-8) :1605-1608
[7]   Structural and electrical properties of silicon dioxide layers with embedded germanium nanocrystals grown by molecular beam epitaxy [J].
Kanjilal, A ;
Hansen, JL ;
Gaiduk, P ;
Larsen, AN ;
Cherkashin, N ;
Claverie, A ;
Normand, P ;
Kapelanakis, E ;
Skarlatos, D ;
Tsoukalas, D .
APPLIED PHYSICS LETTERS, 2003, 82 (08) :1212-1214
[8]   Charge storage and interface states effects in Si-nanocrystal memory obtained using low-energy Si+ implantation and annealing [J].
Kapetanakis, E ;
Normand, P ;
Tsoukalas, D ;
Beltsios, K ;
Stoemenos, J ;
Zhang, S ;
van den Berg, J .
APPLIED PHYSICS LETTERS, 2000, 77 (21) :3450-3452
[9]   Ultralarge capacitance-voltage hysteresis and charge retention characteristics in metal oxide semiconductor structure containing nanocrystals deposited by ion-beam-assisted electron beam deposition [J].
Kim, Y ;
Park, KH ;
Chung, TH ;
Bark, HJ ;
Yi, JY ;
Choi, WC ;
Kim, EK ;
Lee, JW ;
Lee, JY .
APPLIED PHYSICS LETTERS, 2001, 78 (07) :934-936
[10]   Charge-trap memory device fabricated by oxidation of Si1-xGex [J].
King, YC ;
King, TJ ;
Hu, CM .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (04) :696-700